The substrates used in the high-efficiency thick film heating element technology are generally ceramic substrates. The most widely used in thick-film hybrid integrated circuits is 95% to 97% alumina substrates. Others include beryllium oxide and aluminum nitride, Substrate, and so on.
The high-efficiency thick film heating element must have the following three aspects of performance:
1. Printability, the dye needs to have a certain viscosity, and the viscosity decreases with the shear force applied by the squeegee, and it is thixotropic.
2. Functional characteristics: such as the characteristics required as a resistance, conductor, medium, etc.
3. Process compatibility: The paste should have good adhesion to the substrate. When all types of pastes are used together, the different pastes will not have adverse reactions with each other or with the substrate during the entire process.
Compared with traditional heating methods, the seven advantages of high-efficiency thick film heating element:
●1. The thermal efficiency is as high as 97%
●2. When applied to water heating, fluid heating, the substrate is not easy to scale
●3. The power density is generally produced as 60W/cm2, which is several times that of traditional heating elements
●4. The heating is uniform and stable. In the case of electric control, the temperature fluctuation is small, and the temperature control accuracy is ±2℃
●5. Wide application range, AC/DC universal, and high-efficiency thick film heating element can be made into different forms according to different design requirements
●6. Compared with traditional heating elements, the high-efficiency thick film heating element has a small heat capacity, so the heating speed is extremely fast, and there is very little residual heat after power failure
●7.The high-efficiency thick film heating element forms a hydroelectric separation through the inorganic oxide insulating layer, which is more resistant to oxidation, the power attenuation is almost 0, and the service life can reach 15000h
application:
1: Military.
2: Aerospace products.
3: Industrial wireless products.
4: Screen printing process, printed on the insulating substrate.
5: In the field of microelectronics, both thick film technology and thin-film technology can be used to form conductors, resistors, and various dielectric film layers on the substrate
Name: Richard Chen
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